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Arago is an AI and computer hardware company whose mission is to drive the course of history forward. We do so by accelerating breakthroughs at the intersection of AI and semiconductors.
Founded in 2024 by AI researchers and physicists with deep expertise in photonics, electronics, software, mathematics, and machine learning, Arago brings together a lean team of engineers and scientists from the world’s top companies and research labs.
Composed of nine nationalities and operating from hubs in France, North America, and Israel, we believe in great science and fast achievements. Our work is guided by these core principles:
Do great things: we deliver work we’re proud to sign our name to.
High velocity: speed matters. We move quickly, one step at a time.
One unit: we’re all in this together, with relationships grounded in trust, respect, and camaraderie.
Arago is backed by executives from Apple, Arm, Nvidia, Microsoft, and Hugging Face, as well as prominent US and European deeptech venture firms and exited founders.
What you’ll doDrive the co-integration of optical and electronic components through advanced packaging, alignment, and process development, enabling robust, scalable assemblies from prototyping to production.
ResponsibilitiesLead the co-integration of optical and electronic components into robust, scalable assemblies, leveraging 2.5D/3D integration techniques and high-precision placement methods.
Develop and refine packaging and alignment processes, including tooling, fixtures, and test infrastructure. Work closely with the engineering and simulation teams to optimize yield, calibration methods and error-mitigation capabilities.
Support prototype design, builds and bring-up, working closely with photonics, electronics and tooling teams, as well as with industrial partners.
Define assembly procedures and process controls to enable a smooth transition from R&D to scaled production, contributing to the overall co-packaging strategy and integration roadmap.
Collaborate with external partners and vendors on materials, tooling, and process development.
Proven experience in the design and integration of optoelectronic systems, including semiconductor lasers, modulators, detectors, and CMOS electronics.
Strong understanding of optical and electronic packaging techniques, including precision placement and alignment, thermal management and stabilization, and mechanical integration.
Knowledge of semiconductor and photonic manufacturing processes, from early-stage prototyping to pilot-scale production.
Familiarity with material systems (e.g. InP, SiPh, GaAs), bonding and interconnect methods, and reliability considerations at high speed and low power.
Hands-on experience with cleanroom equipment, optical metrology, and assembly tooling is highly valued.
Comfortable operating in a multidisciplinary team and contributing across design, process development, and system integration.
Competitive cash compensation, with final package based on location, experience, and the pay of team members in similar positions.
Meaningful stock option plan offered at the earliest stage of the company (included in the majority of full time offers).
Relocation bonus and coverage of moving expenses for relocation within 20 minutes of the company’s location.
Healthcare coverage (including family-friendly options), pension contributions, professional development support, and 25 days of PTO, in addition to public holidays.
Ownership of a key technical domain, with significant vertical and/or horizontal growth opportunities, based on performance and individual drive.
A high-paced, multicultural (with 9 nationalities), and engineering-led environment.
